Duration
3 Years (6 Sem)
Learning Mode
Online
Semester Fee
25,000
Advance Your Career with B.Voc in Electronics Telecommunication
This specialized Work Integrated Learning Program (WILP) is designed specifically for working professionals. This UGC-approved program aims to equip professionals with advanced knowledge without requiring a career break.
Specializations Offered
Electronics Telecommunication
Eligibility Criteria
10+2 or equivalent from a recognized board , or 10th standard plus a 2-year ITI/Diploma in Electronics, Electrical, Computer Science, or a related field. Working professionals with relevant industry experience looking to upgrade their skills under the National Credit Framework are also encouraged to apply.
Curriculum & Syllabus
Semester 1 (20 Credits)
Applied Mathematics (4 Credits)
Unit 1: Linear Algebra – Matrices and Determinants, Eigenvalues and Eigenvectors, System of Linear Equations.
Unit 2: Calculus – Differentiation and Integration, Multivariable Calculus, Laplace and Fourier Transforms.
Unit 3: Probability and Statistics – Probability Theorems and Distributions, Statistical Measures, Hypothesis Testing.
Unit 4: Applications in Electronics – Differential Equations in Circuits, Fourier Series in Signal Processing, Probability in Communication Systems.
Fundamentals of Electronics (4 Credits)
Unit 1: Basics of Electric Circuits – Ohm's Law, Kirchhoff's Laws, Series and Parallel Circuits, Thevenin's and Norton's Theorems.
Unit 2: Passive Components – Resistors, Capacitors, Inductors, Reactance and Impedance in AC Circuits, Power Factor and Energy Storage.
Unit 3: Semiconductor Basics – PN Junction and Zener Diodes, Diode Characteristics and Applications, Rectifier Circuits.
Unit 4: Power Supplies and Circuit Protection – Voltage Regulators, Circuit Protection Devices, Basics of Power Electronics.
Electronic Circuit Design (6 Credits)
Unit 1: Circuit Analysis Techniques – Mesh and Nodal Analysis, AC/DC Circuit Theorems, Frequency Response.
Unit 2: Amplifier Circuits – Operational Amplifiers (Op-Amps), BJT and FET Amplifiers, Feedback Amplifiers.
Unit 3: Oscillators and Signal Generators – RC, LC, and Crystal Oscillators, Waveform Generators, Pulse Shaping Circuits.
Unit 4: Filters and Signal Conditioning – Low-Pass, High-Pass, Band-Pass Filters, Active vs. Passive Filters, Signal Conditioning for Sensors.
Basic Workshop Practice (6 Credits)
Unit 1: Soldering Techniques – Through-Hole and Surface Mount Soldering, Desoldering and Rework, Soldering Safety.
Unit 2: PCB Assembly and Fabrication – PCB Design and Layout, Etching and Drilling, Assembling and Testing.
Unit 3: Circuit Prototyping and Debugging – Breadboarding Techniques, Testing with Multimeter and Oscilloscope, Circuit Troubleshooting.
Unit 4: Mini Project and Real-World Applications – Simple Amplifier or Power Supply Project, Industry Applications, Report Writing and Documentation.
Semester 2 (20 Credits)
Applied Physics (4 Credits)
Unit 1: Electricity and Magnetism – Coulomb's Law and Electric Fields, Gauss's Law and Applications, Magnetic Fields and Electromagnetic Induction.
Unit 2: Wave Optics – Interference and Diffraction, Polarization and Optical Instruments, Applications in Fiber Optics.
Unit 3: Semiconductor Physics – Energy Bands and Charge Carriers, PN Junctions and Diode Characteristics, Transistors and MOSFET Basics.
Unit 4: Modern Physics Applications – Quantum Mechanics Basics, Photonics and Optoelectronics, Nanotechnology in Electronics.
Digital Logic Design (6 Credits)
Unit 1: Boolean Algebra and Logic Gates – Basic Logic Gates (AND, OR, NOT, XOR, NAND, NOR), Truth Tables and Logic Simplification, Boolean Expressions and Minimization.
Unit 2: Combinational Circuits – Adders, Subtractors, and Multiplexers, Decoders, Encoders, and Comparators, PLA and FPGA Basics.
Unit 3: Sequential Circuits – Flip-Flops (SR, D, JK, T), Registers and Counters, Synchronous vs. Asynchronous Circuits.
Unit 4: Digital System Design Applications – Memory Design (RAM, ROM, Cache), Digital Signal Processing Basics, Microprocessor and Microcontroller Interfacing.
Computer Programming Basics (6 Credits)
Unit 1: Fundamentals of C Programming – Syntax, Data Types, Variables, Operators and Expressions, Input and Output Functions.
Unit 2: Control Structures and Functions – Conditional Statements (if, switch), Looping (for, while, do-while), Functions and Recursion.
Unit 3: Data Structures in C – Arrays and Strings, Pointers and Dynamic Memory Allocation, Structures, Unions, and File Handling.
Unit 4: Application-Based Programming – Debugging and Error Handling, Simple Embedded C for Microcontrollers, Mini Project Development.
Advanced Workshop Practice (4 Credits)
Unit 1: Advanced PCB Design – Multi-Layer PCB Fabrication, PCB Layout Optimization, Solder Masking and Component Placement.
Unit 2: Microcontroller Circuit Assembly – Microcontroller Selection and Pin Configuration, Interfacing Sensors and Actuators, Programming with Embedded C.
Unit 3: Maintenance and Troubleshooting – Debugging Hardware Issues, Testing with Multimeters and Oscilloscopes, Circuit Repair and Component Replacement.
Unit 4: Mini Project and Industrial Applications – Small-Scale Project on Digital Electronics, Prototype Development, Testing, and Reporting.
Semester 3 (20 Credits)
Signals and Systems (4 Credits)
Unit 1: Introduction to Signals and Systems – Classification of Signals (Continuous-Time and Discrete-Time), Standard Signals, System Properties (Linearity, Time-Invariance, Causality).
Unit 2: Fourier Analysis – Fourier Series Representation, Continuous-Time Fourier Transform (CTFT), Discrete-Time Fourier Transform (DTFT).
Unit 3: Laplace and Z-Transforms – Laplace Transform and Properties, Inverse Laplace Transform, Z-Transform Definition and Applications.
Unit 4: Sampling and Signal Processing Applications – Sampling Theorem and Reconstruction, Aliasing and Anti-Aliasing Filters, Basics of DSP.
Analog Electronics (6 Credits)
Unit 1: Semiconductor Devices and Amplifiers – Transistor Configurations and Characteristics, Small-Signal and Large-Signal Amplifiers, Frequency Response.
Unit 2: Oscillators and Waveform Generators – Feedback Oscillators (Hartley, Colpitts, Phase-Shift), Crystal Oscillators, Waveform Generators.
Unit 3: Operational Amplifiers and Applications – Op-Amp Characteristics, Filters, Comparators, Precision Rectifiers and Active Filters.
Unit 4: Power Supplies and Voltage Regulators – Linear and Switching Power Supplies, Voltage Regulators (IC 78XX, 79XX, LM317), Power Management.
Communication Systems (6 Credits)
Unit 1: Introduction to Communication Systems – Elements of Communication Systems, SNR and Bandwidth Considerations, Analog vs. Digital Communication.
Unit 2: Modulation Techniques – Amplitude Modulation (AM), Frequency Modulation (FM), Phase Modulation (PM), Pulse Modulation (PAM, PWM, PPM).
Unit 3: Noise Analysis and Channel Performance – Sources of Noise, Signal-to-Noise Ratio (SNR) and Noise Figure, Effect of Noise in AM/FM Systems.
Unit 4: Antenna and Wireless Basics – Antenna Types and Radiation Patterns, Radio Wave Propagation, Basics of Wi-Fi, Bluetooth, and 5G.
PCB Design and Fabrication (4 Credits)
Unit 1: PCB Basics and Design Techniques – Substrates, Layout Design Software (Eagle, KiCad, Altium), Grounding and Noise Reduction.
Unit 2: PCB Fabrication Process – Photoetching, Chemical Etching, Drilling, Plating, Solder Mask and Silkscreen Printing.
Unit 3: PCB Testing and Debugging – Continuity and Isolation Tests, Debugging and Repair, Signal Integrity and EMI/EMC Considerations.
Unit 4: Advanced PCB Prototyping – Multi-Layer PCB Design, Flexible and Rigid-Flex PCBs, Real-World Case Studies.
Semester 4 (20 Credits)
Microprocessors and Microcontrollers (4 Credits)
Unit 1: Introduction – Evolution, Differences Between Microprocessors and Microcontrollers, Applications in Embedded Systems.
Unit 2: Microprocessor Architecture – Architecture of 8085 and 8086, Addressing Modes, Instruction Set, Assembly Language Programming.
Unit 3: Microcontroller Basics – Overview of 8051 Architecture, Embedded C Programming, Peripheral Interfacing (Timers, Serial Communication, ADC/DAC).
Unit 4: Advanced Microcontroller Applications – Introduction to ARM Cortex Processors, Real-Time Embedded Applications, System Design Case Studies.
IoT Basics and Applications (6 Credits)
Unit 1: IoT Architecture and Sensors – Reference Architecture, Sensors and Actuators, Interfacing with Microcontrollers.
Unit 2: IoT Communication Protocols – MQTT, HTTP, CoAP, Communication layers for IoT devices.
Unit 3: Cloud and Edge Computing – Cloud Platforms (AWS IoT, Firebase), Data Ingestion, and Visualization Dashboards.
Unit 4: IoT Security and Case Studies – Security Challenges, Device Authentication, Smart Home and Industrial IoT Applications.
PCB Design and Advanced Fabrication (6 Credits)
Unit 1: Advanced PCB Design Techniques – Multi-Layer Design and Routing, High-Speed Design Considerations, EMI/EMC Reduction.
Unit 2: Fabrication Process and Materials – Substrate Selection for High-Frequency Applications, Manufacturing Rigid/Flex PCBs, Assembly Techniques.
Unit 3: Testing, Debugging, and Reliability – Electrical and Functional Testing, Signal Integrity Issues, Reliability and Thermal Management.
Unit 4: Industrial Applications – PCB Design for IoT and Embedded Systems, Industrial PCB Fabrication Case Studies, Intro to AI-Based PCB Automation.
Internship (4 Credits)
Industry-based training, hands-on application in embedded systems, IoT, or PCB design, daily work logs, and performance evaluation.
Semester 5 (20 Credits)
Digital Signal Processing (4 Credits)
Unit 1: Introduction to DSP – Signals and Systems Basics, Sampling Theorem, Signal Reconstruction, Discrete-Time Systems.
Unit 2: Z-Transform and DFT – Z-Transform Properties and Inverse, Discrete Fourier Transform (DFT), Fast Fourier Transform (FFT).
Unit 3: FIR and IIR Filter Design – Finite Impulse Response (FIR) Filter Design, Infinite Impulse Response (IIR) Filter Design, Stability Analysis.
Unit 4: DSP Applications – Digital Audio and Image Processing, Real-Time Signal Processing with DSP Processors, Case Studies.
Control Systems (6 Credits)
Unit 1: Introduction to Control Systems – Open-Loop and Closed-Loop Systems, Mathematical Modeling, Transfer Functions, Block Diagrams.
Unit 2: Stability Analysis – Routh-Hurwitz Stability Criterion, Root Locus Method, Nyquist Criterion, Time Response Analysis.
Unit 3: Frequency-Domain Analysis and PID – Bode Plots, Nyquist Plots, Compensation Techniques (Lead, Lag), PID Controller Design.
Unit 4: Control System Applications – Industrial Automation, MATLAB/Simulink Simulation, Real-World Implementation Case Studies.
Embedded Systems (6 Credits)
Unit 1: Architecture – Basics of Embedded Systems, Microcontroller vs. Microprocessor Systems, Memory and I/O Interfaces.
Unit 2: Programming and RTOS – Embedded C Programming, Real-Time Operating Systems (RTOS) Basics, Interrupt Handling, Task Scheduling.
Unit 3: Software Development – Communication Protocols (UART, SPI, I2C), Interfacing Sensors and Displays, Application Debugging.
Unit 4: Applications and Case Studies – IoT-Enabled Embedded Systems, Automation in Automotive and Industry, Design Case Studies.
Internship (4 Credits)
On-site training in embedded systems or automation projects, industry mentor feedback, and technical evaluation.
Semester 6 (20 Credits)
VLSI Design Basics (6 Credits)
Unit 1: Introduction to VLSI Technology – Evolution and Moore's Law, CMOS Technology Overview, Fabrication Process Basics.
Unit 2: Digital Circuit Design – Logic Gates, Combinational and Sequential Circuit Design in VLSI, Low-Power and High-Speed Design.
Unit 3: RTL Coding and HDLs – Verilog and VHDL Basics, RTL Coding Best Practices, Finite State Machine (FSM) Design.
Unit 4: Synthesis, Testing, and Verification – Synthesis and Optimization, Static Timing Analysis (STA), FPGA Implementation and Testing.
Unit 5: VLSI Applications – ASIC vs. FPGA Design, Processor and Memory Design Applications, Industry Mini-Projects.
Wireless Communication (6 Credits)
Unit 1: Fundamentals – Wireless Systems Overview, Frequency Spectrum, Modulation Techniques, Path Loss and Fading.
Unit 2: Cellular Networks and 5G – Cellular Architecture (2G to 5G Evolution), Multiple Access Techniques (TDMA, FDMA, CDMA, OFDMA).
Unit 3: Wireless Protocols – IEEE 802.11 (Wi-Fi), Bluetooth, Zigbee, LTE, VoLTE, and IoT Wireless Standards.
Unit 4: Antenna Design and Propagation – Radiation Patterns, MIMO Antennas, Wireless Sensor Networks (WSN).
Unit 5: Practical Systems – Networking Labs on Wireless Protocols, IoT-Enabled Wireless Network Case Studies.
IoT Systems and Applications (4 Credits)
Unit 1-4: Advanced IoT protocols, enterprise security in IoT networks, edge computing architectures, and end-to-end deployment case studies.
Capstone Project (4 Credits)
Unit 1: Project Planning and Proposal – Problem Identification, Literature Review, Technical Feasibility, and Mentorship.
Unit 2: Implementation and Development – Hardware and Software Integration, Prototyping, Testing, and Validation.
Unit 3: Report Writing and Documentation – Technical Report Standards, User Manuals, Plagiarism Checks, and Compliance.
Unit 4: Presentation and Evaluation – Final Presentation to Industry Experts, Project Demonstration, and Viva-Voce.
Career Outcomes & Job Roles
Graduates are equipped with immediate, deployable skills for the electronics manufacturing, semiconductor, telecommunications, and embedded systems sectors. Target designations include:
Embedded Systems Developer / Programmer
PCB Design & Layout Engineer
Telecom Support / Network Engineer
IoT Application Developer
Automation & Control Technician
Electronics Quality Control / Testing Inspector
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